100v , 20a low r ds(on) n ch trench power mosfet ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 1 aug. 28 2013 features ? v ds ------------------------------------------------------ 1 00 v ? i d ---------------------------------------------------------- 20 a ? r ds ( on ) --------------- 33 m typ.(v gs = 10 v, i d = 10 a) ? built-in gate protect diode ? 100 % uil tested ? rohs compliant applications ? low voltage dc motor driver ? solenoid driver package to220 to220f ekg1020 FKG1020 not to scale equivalent circuit absolute maximum ratings ? unless otherwise specified, t a = 25 c characteristic symbol test conditions rating unit ekg1020 FKG1020 drain to source voltage v dss 100 v gate to source voltage v gss 20 v continuous drain current i d(dc) 20 a pulsed drain current i d( pulse) pw 100 s duty cycle 1 % 60 a continuous diode forward current i sd (dc) 20 a diode pulse current i sd (pulse) pw 100 s duty cycle 1 % 60 a single pulse avalanche energy e as v dd = 20 v, l = 200 h, i lp = 20 a, unclamped, r g = 50 , see figure 1 50 mj maximum avalanche current i as 20 a maximum power dissipation p d t c = 25 c 55 40 w thermal resistance j-c 2 .2 7 3 .1 3 c/w j-a 6 2 .5 c/w operating junction temperature t j 150 c storage temperature t stg ? 55 to 150 c (1) (2) (3) g d s (1) (2) (3) g d s d(2) s(3) g(1) downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 2 aug. 28 2013 electrical characteristics ? unless otherwise specified, t a = 25 c characteristic symbol test conditions m in . t yp . m ax . unit drain to source breakdown voltage v (br)dss i d = 1 ma, v gs = 0 v 100 ? ? v drain to source breakdown voltage temp. coefficient v (br)dss i d = 1 ma, v gs = 0 v ? 80 ? mv/c drain to source leakage current i dss v ds = 100 v, v gs = 0 v ? ? 100 a gate to source leakage current i gss v gs = 20 v ? ? 10 a gate threshold voltage v th v ds = 10 v, i d = 1 ma 1.5 2 .0 2.5 v gate threshold voltage temp. coefficient v th v ds = 10 v, i d = 1 ma ? ? 6 ? mv/c static drain to source on -resistance r ds(on) i d = 10 a, v gs = 10 v ? 33 52 m i d = 10 a, v gs = 4.5 v ? 36 59 forward transfer admittance |y fs | v ds = 10 v, i d = 10 a 9 .0 ? ? s input capacitance c iss v ds = 10 v v gs = 0 v f = 1 mhz ? 2200 ? pf output capacitance c oss ? 210 ? reverse transfer capacitance c rss ? 110 ? total gate charge q g v dd = 50 v i d = 10 a, v gs = 10 v r l = 5 ? 45 ? nc gate to source charge q gs ? 4 ? gate to drain charge q gd ? 9 ? turn-on delay time t d(on) v dd = 50 v i d = 10 a r l = 5 , r g = 10 v gs = 10 v , see figure 3 ? 15 ? ns rise time t r ? 20 ? turn-off delay time t d(off) ? 180 ? fall time t f ? 90 ? source-drain diode forward voltage v sd i sd = 20 a, v gs = 0 v ? 0.9 1.2 v source-drain diode reverse recovery time t rr i sd = 20 a di/dt = 100 a/s see figure 2 ? 50 ? ns i sd = 20 a di/dt = 100 a/s t c = 150 c see figure 2 ? 60 ? ns source-drain diode recovery charge q rr i sd = 20 a di/dt = 100 a/s see figure 2 ? 90 ? nc i sd = 20 a di/dt = 100 a/s t c = 150 c see figure 2 ? 120 ? nc downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 3 aug. 28 2013 test circuits and waveforms v dd i l v ds r g v gs 0 v i lp i l v (br)dss v dd v ds (a) test circuit (b) waveform figure 1 unclamped inductive v gs 0 v i sd r g l d.u.t. v dd 0 v i sd t rr di/dt i rm 90 % i rm (a) test circuit (b) waveform figure 2 diode reverse recovery time i d v ds v dd r g r l v gs 0 v p.w. = 10 s duty cycle 1 % t d(on) t r t on t d(off) t f t off 90% 10% 90%10% v gs v ds (a) test circuit (b) waveform figure 3 switching time dd (br)dss (br)dss 2 lp as v v v il 2 1 e ? ? ?? ? downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 4 aug. 28 2013 performance curves 0 20 40 60 0 1 2 3 id (a) vds (v) id -vds characteristics (typical) 10v 3.5v vgs =3v 4v 4.5v tc=25 0 10 20 30 40 50 60 0 1 2 3 4 5 id (a) vgs (v) id -vgs characteristics (typical) vds=10v 25 75 tc = 125 0.0 0.5 1.0 1.5 0 5 10 15 20 vds (v) vgs (v) vds-vgs characteristics (typical) id=20a id=5a tc=25 id=10a 0 20 40 60 80 0 10 20 30 40 50 60 rds(on) (m ) id (a) rds(on)-id characteristics (typical) vgs=10v vgs=4.5v tc=25 0 20 40 60 80 0 50 100 150 rds(on) (m ) tc ( ) rds(on)- tc characteristics (typical) vgs=10v vgs=4.5v id=10a 0 20 40 60 0.0 0.5 1.0 1.5 isd (a) vsd (v) isd- vsd characteristics (typical) tc=25 75 125 0 50 100 150 200 250 0 10 20 30 40 50 60 rds(on) maximum (m ) id (a) rds(on)-id characteristics (maximum ) vgs=10v tc=150 0 10 20 30 40 50 60 0 10 20 30 40 50 vds (v) qg (nc) dynamic input output characteristics (typical) vgs (v) 0 2 4 6 8 10 12 tc=25 vdd P 50v id=10a 10 100 1000 10000 0 10 20 30 40 50 capacitance (pf) vds (v) ciss coss crss capacitance-vds caracteristics (typical) tc=25 vgs 0v f=1mhz 1 10 100 1000 1 10 100 sw time (ns) id (a) sw time - id characteristics (typical) td(on) tr tf td(off) tc=25 vdd P 50v rg=10 vgs=10v r load 1 10 100 1000 1 10 100 sw time (ns) rg () sw time - rg characteristics (typical) td(on) tr tf td(off) tc=25 vdd P 50v id=10a vgs=10v r load downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 5 aug. 28 2013 0.1 1 10 100 0.1 1 10 100 id (a) vds (v) safe operating area tc=25 single pulse 0 10 20 30 40 50 60 70 80 90 100 25 50 75 100 125 150 e as (normalized) (%) t ch(start) ( eas - tc(start) characteristics ekg1020 FKG1020 0 10 20 30 40 50 0 50 100 150 pd (w) ta ( ) pd -ta characteristics without heatsink 0 10 20 30 40 50 60 0 50 100 150 pd (w) ta ( ) pd -ta characteristics without heatsink downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 6 aug. 28 2013 package outline notes: 1) dimension is in millimeters. 2) pin treatment pb-free. device composition compliant with the rohs directive marking diagram part number ymw baa ekg1020 lot number y is the last digit of the year (0 to 9) m is the month (1 to 9, o, n or d) w is the week (1 st to 5 th week of every month) b expresses pb free pins a is the suffix no. 1.52 0.10 0.08 0.10 to220 downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 7 aug. 28 2013 package outline notes: 1) dimension is in millimeters. 2) pin treatment pb-free. device composition compliant with the rohs directive marking diagram part number ymw baa FKG1020 lot number y is the last digit of the year (0 to 9) m is the month (1 to 9, o, n or d) w is the week (1 st to 5 th week of every month) b expresses pb free pins a is the suffix no. to220f downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 8 aug. 28 2013 operating precautions in the case that you use sanken products or design your products by us ing sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating ma y be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltag e or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresse s such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperatur e, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stresses, instantaneo us values, maximum values and minimum values must be taken into considera tion. in addition, it should be noted that since power devices or ics includi ng power devices have large self-heating value, the degree of derating of junction tem perature affects the reliability significantly. because reliability can be affected adversely by improper storage environme nts and handling methods, please observe the following cautions. cautions for storage ? ensure that storage conditions comply with the standard temperature (5 to 3 5c) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme change s in temperature or humidity. ? avoid locations where dust or harmful gases are present and avoid direct sunligh t. ? reinspect for rust on leads and solderability of the products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and w rong connections. ensure all test parameters are within the ratings specified by sanken for the products. remarks about using silicone grease with a heatsink ? when silicone grease is used in mounting the products on a heatsink, it s hall be applied evenly and thinly. if more silicone grease than required is applied, it may produce excess stress. ? volatile-type silicone greases may crack after long periods of time, resu lting in reduced heat radiation effect. silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. our recommended silicone greases for heat radiation purposes, which will no t cause any adverse effect on the product life, are indicated below: type suppliers g746 shin-etsu chemical co., ltd. yg6260 momentive performance materials inc. sc102 dow corning toray co., ltd. cautions for mounting to a heatsink ? when the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. for mounting the products, the mounting surface flatness should be 0 .05mm or less. ? please select suitable screws for the product shape. do not use a flat-head m achine screw because of the stress to the products. self-tapping screws are not recommended. when using self- tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. that may stress the products and may cause failures. ? recommended screw torque: package recommended screw torque to -220 , to- 220f 0.490 to 0.686 n ? m (5 to 7 kgf ? cm) to -3p , to-3pf 0.686 to 0.882 n ? m (7 to 9 kgf ? cm) sla 0.588 to 0.784 n ? m (6 to 8 kgf ? cm) ? for tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. tightening with an air driver makes a substantial impact. in addition, a s crew torque higher than the set torque can be applied and the package may be damaged. therefore, an electric driver is rec ommended. when the package is tightened at two or more places, first pre-tighten w ith a lower torque at all places, then tighten with the specified torque. when using a power driver, torque control is mandatory. ? please pay special attention about the slack of the press mold. in case that the hole d iameter of the heatsink is less than 4 mm, it may cause the resin crack at tightening. downloaded from: http:///
ekg1020 / FKG1020 ekg1020/ FKG1020 rev.1.0 sanken electric co.,ltd. 9 aug. 28 2013 soldering ? when soldering the products, please be sure to minimize the working time, within the following limits: ? 260 5 c 10 1 s (flow, 2 times) ? 380 10 c 3.5 0.5 s (soldering iron, 1 time) ? soldering should be at a distance of at least 1.5 mm from the body of the pr oducts. electrostatic discharge ? when handling the products, the operator must be grounded. grounded wr ist straps worn should have at least 1m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. ? workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. ? when using measuring equipment such as a curve tracer, the equipment shou ld be grounded. ? when soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. ? the products should always be stored and transported in sanken shipp ing containers or conductive containers, or be wrapped in aluminum foil. important notes ? the contents in this document are subject to changes, for improvement a nd other purposes, without notice. make sure that this is the latest revision of the document before use. ? application and operation examples described in this document are quoted for the so le purpose of reference for the use of the products herein and sanken can assume no responsibility f or any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. unless otherwise agreed in writing by sanken, sanken makes no warrantie s of any kind, whether express or implied, as to the products, including product merchantability, and fitness for a particular purpose and special environment, and the information, including its accuracy, usefulness , and reliability, included in this document. ? although sanken undertakes to enhance the quality and reliability of its pr oducts, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. users of sank en products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or mal function. ? sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunicatio n equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where high er reliability is required (transportation equipment and its control systems, traffic signal control systems or equ ipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems , life support systems, etc.) is strictly prohibited. ? when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the produ cts, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ? anti radioactive ray design is not considered for the products listed herein. ? sanken assumes no responsibility for any troubles, such as droppin g products caused during transportation out of sankens distribution network. ? the contents in this document must not be transcribed or copied without sanken s written consent. downloaded from: http:///
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